PACKAGE ON PACKAGE DEVICES AND METHODS OF PACKAGING SEMICONDUCTOR DIES

摘要

Disclosed are a package on package device and a method thereof capable of packaging a semiconductor die. The PoP device includes a bottom package die which includes a solder ball on the upper side thereof and a top package die which includes a metal stud bump on the lower side thereof. The metal stud bump includes a bump region and a tail region which is connected to the bump region. Each metal stud bump on the top package die is connected to one solder ball on the bottom package die.