发明名称 |
SYSTEM AND METHOD FOR CALIBRATING CHIPS IN A 3D CHIP STACK ARCHITECTURE |
摘要 |
A system and method is disclosed for adaptively adjusting a driving strength of a signal between a first and second chip in a 3D architecture/stack. This may be used to adaptively calibrate a chip in a 3D architecture/stack. The system may include a transmission circuit on one chip and a receiver circuit on another chip. Alternatively, the system may include a transmission and receiver circuit on just one chip. |
申请公布号 |
US2015002194(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201414489508 |
申请日期 |
2014.09.18 |
申请人 |
Taiwan Semiconductor Manufacturing Co., Ltd. |
发明人 |
HSU Ying-Yu;SHEEN Ruey-Bin;CHANG Chih-Hsien |
分类号 |
H03K17/94 |
主分类号 |
H03K17/94 |
代理机构 |
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代理人 |
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主权项 |
1. A system for calibrating a chip in a 3D chip stack, the system comprising:
a first and a second chip in said chip stack; said first chip comprising a calibration driver circuit, a receiver circuit, and a plurality of loop circuits, wherein each loop circuit in a subset of said plurality of loop circuits includes a load on said second chip; wherein said calibration driver circuit is configured to send a calibration signal to each of said plurality of loop circuits; wherein said receiver circuit is configured to receive from said loop circuits a plurality of respective loop signals, determine a driving signal based in part on said loop signals, and send said driving signal to said calibration driver circuit; and wherein said calibration driver circuit is configured to produce a modified calibration signal in response to said driving signal. |
地址 |
Hsin-Chu TW |