发明名称 |
IMPRINT APPARATUS AND ARTICLE MANUFACTURING METHOD USING SAME |
摘要 |
An imprint apparatus forms a pattern of a resin on a region to be processed of a substrate using a mold including a pattern region on which a pattern is formed and includes a correction unit configured to correct a shape of a target region that is either the pattern region on the mold or the region to be processed on the substrate, wherein the correction unit further includes: a heating unit configured to heat an object corresponding to the target region of either the mold or the substrate in a heating region having an area smaller than that of the pattern region on the mold; a scanning unit configured to scan the heating region with respect to the target region by changing the relative position of the target region and the heating region; and a control unit configured to acquire information regarding a correction deformation amount of the target region and control the heating unit and the scanning unit based on the information. |
申请公布号 |
US2015001751(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201314372938 |
申请日期 |
2013.01.25 |
申请人 |
CANON KABUSHIKI KAISHA |
发明人 |
Matsuda Yozo;Hasegawa Noriyasu;Hiura Mitsuru;Hayashi Tatsuya |
分类号 |
B29C59/00;B29C59/16 |
主分类号 |
B29C59/00 |
代理机构 |
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代理人 |
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主权项 |
1. An imprint apparatus that forms a pattern of a resin on a region to be processed of a substrate using a mold including a pattern region on which a pattern is formed, the imprint apparatus comprising:
a correction unit configured to correct a shape of a target region that is either the pattern region on the mold or the region to be processed on the substrate, wherein the correction unit further includes:
a heating unit configured to heat an object corresponding to the target region of either the mold or the substrate in a heating region having an area smaller than that of the pattern region on the mold;a scanning unit configured to scan the heating region with respect to the target region by changing the relative position of the target region and the heating region; anda control unit configured to acquire information regarding a correction deformation amount of the target region and control the heating unit and the scanning unit based on the information. |
地址 |
Tokyo JP |