Methods of Forming Conductive Materials on Contact Pads

摘要

Methods of forming conductive materials on contact pads for semiconductor devices and packages. Substrate is provided with contact pads formed thereon. Conductive material is formed over the contact pads by a depositing process followed by a heating process to alter the chemical properties of the conductive material. Optionally, a dispersing process may be incorporated. An interconnect structure can be mounted over the conductive material where the interconnect structure is attached to the conductive material without any active treatment to the conductive material after formation.

主权项

1. A method comprising:
(a) providing a substrate having an upper surface and a lower surface, the lower surface opposite the upper surface; (b) forming a contact pad over the upper surface of the substrate; (c) forming a conductive material over the contact pad including:
(i) depositing the conductive material;(ii) dispersing the conductive material from an initial area to a final area, the final area greater than the initial area;(iii) heating the conductive material; and (d) mounting an interconnect structure over the conductive material, wherein the interconnect structure is attached to the conductive material without any active treatment to the conductive material after the forming step (c).