发明名称 |
HYBRID ELECTRO-OPTICAL PACKAGE FOR AN OPTO-ELECTRONIC ENGINE |
摘要 |
A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided. |
申请公布号 |
US2015003841(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201214365294 |
申请日期 |
2012.01.31 |
申请人 |
McLaren Moray;Rosenberg Paul Kessler;Tan Michael Renne Ty;Morris Terrel |
发明人 |
McLaren Moray;Rosenberg Paul Kessler;Tan Michael Renne Ty;Morris Terrel |
分类号 |
G02B6/43;G02B6/42;H04B10/25;H01L25/16 |
主分类号 |
G02B6/43 |
代理机构 |
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代理人 |
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主权项 |
1. A hybrid electro-optical package for an opto-electronic engine, said package comprising:
a carrier substrate, said carrier substrate including a plurality of electrical vias and an optical via, said plurality of electrical vias and said optical via communicating between a back side and a front side of said carrier substrate; a plurality of intra-package electrical interconnects, an intra-package electrical interconnect coupled to a respective electrical via of said carrier substrate; and a package base, said package base coupled to said carrier substrate by said plurality of intra-package electrical interconnects; wherein said carrier substrate is to interconnect electrically with an opto-electronic component mounted on a back side of said carrier substrate, and includes an optical aperture at a front side of said carrier substrate for communication of optical signals through said optical via; and wherein said package base is to provide for communication of electrical signals to an integrated circuit and said opto-electronic component disposed at a back side of said hybrid electro-optical package transmitted through a plurality of lands disposed at a front side of said package base. |
地址 |
Bristol GB |