发明名称 HYBRID ELECTRO-OPTICAL PACKAGE FOR AN OPTO-ELECTRONIC ENGINE
摘要 A hybrid electro-optical package for an opto-electronic engine. The package includes a carrier substrate, and a package base. Electrical vias and an optical via of the carrier substrate communicate between a back side and a front side of the carrier substrate. The package base is coupled to the carrier substrate by intra-package electrical interconnects. The carrier substrate is to interconnect electrically with an opto-electronic component mounted on its back side, and includes an optical aperture at its front side for communication of optical signals. Similarly, lands disposed at a front side of the package base provide for communication of electrical signals to an integrated circuit and the opto-electronic component. A system and an opto-electronic engine that include the hybrid electro-optical package are also provided.
申请公布号 US2015003841(A1) 申请公布日期 2015.01.01
申请号 US201214365294 申请日期 2012.01.31
申请人 McLaren Moray;Rosenberg Paul Kessler;Tan Michael Renne Ty;Morris Terrel 发明人 McLaren Moray;Rosenberg Paul Kessler;Tan Michael Renne Ty;Morris Terrel
分类号 G02B6/43;G02B6/42;H04B10/25;H01L25/16 主分类号 G02B6/43
代理机构 代理人
主权项 1. A hybrid electro-optical package for an opto-electronic engine, said package comprising: a carrier substrate, said carrier substrate including a plurality of electrical vias and an optical via, said plurality of electrical vias and said optical via communicating between a back side and a front side of said carrier substrate; a plurality of intra-package electrical interconnects, an intra-package electrical interconnect coupled to a respective electrical via of said carrier substrate; and a package base, said package base coupled to said carrier substrate by said plurality of intra-package electrical interconnects; wherein said carrier substrate is to interconnect electrically with an opto-electronic component mounted on a back side of said carrier substrate, and includes an optical aperture at a front side of said carrier substrate for communication of optical signals through said optical via; and wherein said package base is to provide for communication of electrical signals to an integrated circuit and said opto-electronic component disposed at a back side of said hybrid electro-optical package transmitted through a plurality of lands disposed at a front side of said package base.
地址 Bristol GB