发明名称 |
SOLDER BUMP CONNECTION AND METHOD OF MAKING |
摘要 |
A layer of material can protect a surface of a passivation layer against damage during a final via plug process. The protective layer can be a conductive bump limiting metallurgy (BLM) base layer and can include titanium tungsten (TiW), though other materials can be employed. Examples include applying the protective layer after formation of a via opening and prior to formation of a via opening, and can include applying more protective material after conductor plug formation to enhance protection. Photosensitive and non-photosensitive passivation layers can be so protected. |
申请公布号 |
US2015001712(A1) |
申请公布日期 |
2015.01.01 |
申请号 |
US201313927759 |
申请日期 |
2013.06.26 |
申请人 |
International Business Machines Corporation |
发明人 |
Daubenspeck Timothy H.;Gambino Jeffrey P.;Muzzy Christopher D.;Sauter Wolfgang |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Armonk NY US |