发明名称 |
Method of detecting wire bonding failures |
摘要 |
Disclosed is a method of detecting a bonding failure of a wire bonder, which comprises a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire. The method comprises the steps of: forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds, wherein the first surface is not electrically-conductive; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting whether the second wire bond remains bonded to the substrate; and determining an occurrence of the bonding failure if the second wire bond is no longer bonded to the substrate. |
申请公布号 |
US8919632(B2) |
申请公布日期 |
2014.12.30 |
申请号 |
US201213673558 |
申请日期 |
2012.11.09 |
申请人 |
ASM Technology Singapore Pte. Ltd. |
发明人 |
Liu Wei;Zhang Qian;Lee Joon Ho;Kim Jung Min |
分类号 |
B23K31/12;B23K31/02;B23K3/08 |
主分类号 |
B23K31/12 |
代理机构 |
Sughrue Mion, PLLC |
代理人 |
Sughrue Mion, PLLC |
主权项 |
1. A method of detecting a bonding failure of a wire bonder, the wire bonder comprising a bonding tool operative to form an electrical connection between a semiconductor die and a substrate using a bonding wire, the method comprising the steps of:
forming a first wire bond on a first surface located on the semiconductor die using the bonding tool and the bonding wire; forming a second wire bond on a second surface located on the substrate using the bonding tool and the bonding wire such that a wire loop connects the first and second wire bonds; moving the bonding tool in a direction away from the second wire bond to break the bonding wire from the second wire bond; detecting that the second wire bond does not remain bonded to the substrate; and determining an occurrence of the bonding failure, wherein the step of detecting that the second wire bond does not remain bonded to the substrate comprises the steps of: moving the bonding tool in a direction towards the substrate while detecting a position of the bonding tool at which an electrical connection occurs between the bonding wire and the substrate; comparing the detected position of the bonding tool with a predetermined position of the bonding tool, the predetermined position of the bonding tool indicating an absence of a bonding failure; detecting that the detected position of the tip of the bonding tool does not substantially correspond to the predetermined position of the bonding tool; and determining that the second wire bond is no longer bonded to the substrate. |
地址 |
Singapore SG |