发明名称 |
SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE |
摘要 |
A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces a liquid phase having a content of a non-volatile component of 300 ppm or more when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G. |
申请公布号 |
SG11201407029X(A) |
申请公布日期 |
2014.12.30 |
申请号 |
SGX11201407029 |
申请日期 |
2013.03.26 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
IWANO TOMOHIRO;MINAMI HISATAKA;AKUTSU TOSHIAKI;FUJISAKI KOJI |
分类号 |
H01L21/304;B24B37/00;C09K3/14 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|