发明名称 SLURRY, POLISHING-SOLUTION SET, POLISHING SOLUTION, SUBSTRATE POLISHING METHOD, AND SUBSTRATE
摘要 A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces a liquid phase having a content of a non-volatile component of 300 ppm or more when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G.
申请公布号 SG11201407029X(A) 申请公布日期 2014.12.30
申请号 SGX11201407029 申请日期 2013.03.26
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 IWANO TOMOHIRO;MINAMI HISATAKA;AKUTSU TOSHIAKI;FUJISAKI KOJI
分类号 H01L21/304;B24B37/00;C09K3/14 主分类号 H01L21/304
代理机构 代理人
主权项
地址