发明名称 Probe card and method for manufacturing probe card
摘要 A probe card for conducting an electrical test on a test subject includes a substrate body including a first surface, which faces toward the test subject, and a second surface, which is opposite to the first surface. A through electrode extends through the substrate body between the first surface and the second surface. A contact bump is formed in correspondence with the electrode pad and electrically connected to the through electrode. An elastic body is filled in an accommodating portion, which is formed in the substrate body extending from the first surface toward the second surface. The contact bump is formed on the elastic body.
申请公布号 US8922234(B2) 申请公布日期 2014.12.30
申请号 US201314067685 申请日期 2013.10.30
申请人 Shinko Electric Industries Co., Ltd. 发明人 Shiraishi Akinori;Sakaguchi Hideaki;Higashi Mitsutoshi
分类号 G01R31/00;G01R1/073;H05K3/40 主分类号 G01R31/00
代理机构 Wolf, Greenfield & Sacks, P.C. 代理人 Wolf, Greenfield & Sacks, P.C.
主权项 1. A probe card for electrically connecting to an electrode pad formed on a test subject to conduct an electrical test on the test subject, the probe card comprising: a substrate body including a first surface located to face toward the test subject, and a second surface opposite to the first surface; a through electrode formed in a first through hole extending through the substrate body between the first surface and the second surface; an elastic body formed in a second through hole extending through the substrate body between the first surface and the second surface, wherein the elastic body includes a first surface exposed from the first surface of the substrate body and a second surface exposed from the second surface of the substrate body; a support body formed in a third through hole extending through the elastic body between the first and second surfaces of the elastic body; a wire formed on the first surface of the substrate body, wherein the wire includes a first end connected to an end of the through electrode exposed from the first surface of the substrate body and a second end connected to an end of the support body exposed from the first surface of the elastic body, and the wire extends along the first surface of the elastic body between the first end and the second end; and a contact bump formed in correspondence with the electrode pad, connected to the end of the support body via the second end of the wire, and electrically connected to the through electrode by the wire.
地址 Nagano-ken JP
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