发明名称 METHODS OF FORMING PADS, METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME, CONDUCTIVE PAD ARRAYS, AND SEMICONDUCTOR DEVICES INCLUDING THE SAME
摘要 A conductive pad array comprises a plurality of first conductive pad rows and second conductive pad rows. The first conductive pad rows comprise a plurality of first conductive pads which is arranged on a substrate along a second direction, and are arranged along a first direction which is perpendicular to the second direction. The second conductive pad rows comprise a plurality of second conductive pads which is arranged on the substrate along the second direction, and are arranged between the first conductive pad rows. Each of the first conductive pads has first and second sides of a straight line which are parallel to the second direction, and has third and fourth sides which are concave in the second direction. Each of the second conductive pads has first and second sides in a straight line which are parallel to the second direction and has third and fourth sides which are convex in the second direction.
申请公布号 KR20140147434(A) 申请公布日期 2014.12.30
申请号 KR20130070688 申请日期 2013.06.20
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 PARK, JE MIN;LIM, SEOK HYUN;SONG, TAE YONG;YOON, HYUN CHUL;HWANG, YOO SANG;JUNG, HYEON OK
分类号 H01L21/60;H01L21/8242;H01L27/108 主分类号 H01L21/60
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