Power electronics modules with solder layers having reduced thermal stress

摘要

Power electronics modules having solder layers with reduced thermal-stress are disclosed. In one embodiment, a power electronics module includes a power electronics device having a first surface, a second surface, a first edge, and a second edge opposite the first edge. The power electronics device has a device length measured from the first edge to the second edge. A first solder layer is adjacent to the first surface of the power electronics device, and a second solder layer is adjacent to the second surface. The first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device. A first thermally conductive layer is adjacent to the first solder layer, and a second thermally conductive layer is adjacent to the second solder layer. In some embodiments, the first and second solder layers have tapered portions.

主权项

1. A power electronics module comprising:
a power electronics device comprising a first surface, a second surface opposite from the first surface, a first edge, and a second edge opposite the first edge, the power electronics device having a device length measured from the first edge to the second edge; a first solder layer adjacent to the first surface of the power electronics device; a second solder layer adjacent to the second surface of the power electronics device, wherein the first solder layer and the second solder layer have a maximum thickness T along a length that is less than the device length of the power electronics device; a first thermally conductive layer adjacent to the first solder layer, wherein the first solder layer thermally couples the first thermally conductive layer to the first surface of the power electronics device; a second thermally conductive layer adjacent to the second solder layer, wherein the second solder layer thermally couples the second thermally conductive layer to the second surface of the power electronics device; and a thermally conductive sealing material, wherein:
the thermally conductive sealing material contacts a portion of the first surface of the power electronics device and a portion of the second surface of the power electronics device; andthe thermally conductive sealing material contacts the first solder layer, the second solder layer, the first thermally conductive layer, and the second thermally conductive layer.