MODULAR COMPUTER AND THERMAL MANAGEMENT

摘要

An enclosure design facilitates heat dissipation from a space-limited computer core device. An external computer platform is provided to connect the computer core device, the external computer platform including a fan that provides an air flow to the connected computer core device. The computer core device and the computing platform may be tightly connected by connectors located on their respective enclosure walls. Both the computer core device and the external computing platform are provided air inlets and outlets on their respective enclosures. When connected, an air inlet of the computer core device faces an air outlet of the external computing platform such that a single cooling air flow flows through the external computing platform and the computer core device. The external computing platform may include a built-in fan to blow air into or draw air from the matching air inlets and outlets.

主权项

1. A modular computer, comprising:
an enclosure having at least one pair of openings for air to enter or exit from the enclosure; a circuit board inside the enclosure on which is mounted one or more memory circuits and a plurality of interface circuits including a power interface circuit and at least one of: a data interface circuit and a video interface circuit; an electrical connector provided for carrying signals of at least one of the interface circuits, the electrical connector being mounted on one end of the circuit board and positioned for mechanically mating and electrically connecting to a matching electrical connector on an external computing platform; an embedded controller (EC) including a micro-controller for communicating with one or more devices in the external computing platform; a control circuit on the circuit board coupled to the embedded controller, the plurality of interface circuits and the memory circuits wherein, when the portable modular computer is connected to the computing platform, the control circuit takes control of the external computing platform to integrate the modular computer with the external computing platform to thereby form an integrated computing device; and a cooling module mounted on the control circuit.