| 摘要 |
The invention relates to a device for sealing at least one hole formed in a component, characterized in that it comprises a support (10) mounted on the component and carrying, on its surface (11a) facing the component, a material (12) that inflates when heated, and in that at least a portion of the support (10) carrying the material (12) leads into the hole (3) so that as said material inflates it fills said hole or holes (3). |
