Semiconductor device

摘要

A semiconductor device in which warpage is less likely to occur. In the semiconductor device, two semiconductor chips are mounted over a diagonal of a substrate and one of the semiconductor chips lies over the intersection of the two diagonals of the substrate. The semiconductor device gives a solution to the following problem. In order to implement a semiconductor device with a plurality of semiconductor chips mounted on a substrate, generally the substrate must have a larger area. If the area of the substrate is increased without an increase in its thickness, warpage or deformation of the semiconductor device is more likely to occur. It is difficult or impossible to mount a warped or deformed semiconductor device over a wiring substrate.

主权项

1. A semiconductor device comprising:
a rectangular substrate having:
a main surface;a back surface opposite thereto;a first side on the main surface;a second side opposite to the first side;a third side intersecting the first side and the second side;a fourth side opposite to the third side;a first corner where the first side and the third side intersect each other;a second corner where the second side and the fourth side intersect each other;a third corner where the first side and the fourth side intersect each other; anda fourth corner where the third side and the second side intersect each other; a first semiconductor chip lying over a virtual first diagonal coupling the first corner with the second corner over the main surface; and a second semiconductor chip lying over the first diagonal over the main surface, wherein the first semiconductor chip lies over an intersection between a virtual second diagonal coupling the third corner with the fourth corner over the main surface and the first diagonal.