发明名称 Embedded Memory and Methods of Forming the Same
摘要 An embedded flash memory device includes a gate stack, and source and drain regions in the semiconductor substrate. The first source and drain regions are on opposite sides of the gate stack. The gate stack includes a bottom dielectric layer over the semiconductor substrate, a charge trapping layer over the bottom dielectric layer, a top dielectric layer over the charge trapping layer, a high-k dielectric layer over the top dielectric layer, and a metal gate over the high-k dielectric layer.
申请公布号 US2014374814(A1) 申请公布日期 2014.12.25
申请号 US201313924297 申请日期 2013.06.21
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Wu Wei Cheng;Chuang Harry-Hak-Lay
分类号 H01L27/115;H01L27/11 主分类号 H01L27/115
代理机构 代理人
主权项 1. A device comprising: a semiconductor substrate; and an embedded flash memory device comprising: a first gate stack comprising: a bottom dielectric layer over the semiconductor substrate;a charge trapping layer over the bottom dielectric layer;a top dielectric layer over the charge trapping layer;a first high-k dielectric layer over the top dielectric layer; anda first metal gate over the first high-k dielectric layer; andfirst source and drain regions in the semiconductor substrate, wherein the first source and drain regions are on opposite sides of the first gate stack.
地址 Hsin-Chu TW