发明名称 |
Embedded Memory and Methods of Forming the Same |
摘要 |
An embedded flash memory device includes a gate stack, and source and drain regions in the semiconductor substrate. The first source and drain regions are on opposite sides of the gate stack. The gate stack includes a bottom dielectric layer over the semiconductor substrate, a charge trapping layer over the bottom dielectric layer, a top dielectric layer over the charge trapping layer, a high-k dielectric layer over the top dielectric layer, and a metal gate over the high-k dielectric layer. |
申请公布号 |
US2014374814(A1) |
申请公布日期 |
2014.12.25 |
申请号 |
US201313924297 |
申请日期 |
2013.06.21 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Wu Wei Cheng;Chuang Harry-Hak-Lay |
分类号 |
H01L27/115;H01L27/11 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A device comprising:
a semiconductor substrate; and an embedded flash memory device comprising:
a first gate stack comprising:
a bottom dielectric layer over the semiconductor substrate;a charge trapping layer over the bottom dielectric layer;a top dielectric layer over the charge trapping layer;a first high-k dielectric layer over the top dielectric layer; anda first metal gate over the first high-k dielectric layer; andfirst source and drain regions in the semiconductor substrate, wherein the first source and drain regions are on opposite sides of the first gate stack. |
地址 |
Hsin-Chu TW |