| 发明名称 |
WATER REMOVING METHOD, OPTICAL FIBER SOLDERING METHOD, AND SEMICONDUCTOR LASER MODULE MANUFACTURING METHOD |
| 摘要 |
A moisture removing method disclosed removes moisture contained in a dielectric film provided on one end surface of an optical fiber. This moisture removing method causes near infrared light to enter the optical fiber through the other end surface to heat moisture in the dielectric film with use of the near infrared light. |
| 申请公布号 |
US2014374468(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201414478383 |
申请日期 |
2014.09.05 |
| 申请人 |
FUJIKURA LTD. |
发明人 |
Sakamoto Akira |
| 分类号 |
B23K1/20;F26B3/28;B23K1/00;F26B3/30 |
主分类号 |
B23K1/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A moisture removing method for removing moisture contained in a dielectric film provided on a first end surface of an optical fiber,
the moisture removing method comprising a heating step of causing near infrared light to enter the optical fiber through a second end surface to heat the moisture in the dielectric film with use of the near infrared light. |
| 地址 |
Tokyo JP |
