SOLDERING METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

Provided is a soldering method through nickel plating layer to reduce void occurrence rate and a method of manufacturing semiconductor device by using the soldering method. By heating a copper base plate having a nickel plating layer at a temperature range of 300° C. to 400° C. in an inert gas atmosphere beforehand, void occurrence rate can be reduced in soldering the copper base plate to an insulating circuit board.

主权项

1. A soldering method comprising:
heating a member having a nickel plating layer in a temperature range of 300° C. to 400° C. in an inert gas atmosphere, and reducing a nickel oxide film on a surface of the nickel plating layer; and joining the member to a joined member with solder in a reducing gas atmosphere.