发明名称 METHOD OF CONNECTING MUTUALLY TRACKS PRESENT ON SIDE SURFACES OF SUBSTRATE OPPOSITE TO EACH OTHER
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for forming a conductive connection part between two conductive tracks present on side surfaces of a conductive substrate opposite to each other.SOLUTION: A method for forming a conductive connection part between two conductive tracks present on side surfaces of a conductive substrate opposite to each other includes the steps of: a) preparing a substrate which has at least one first conductive track present on one side surface of the substrate and at least one second conductive track present on the other side surface of the substrate opposite to the one side surface; b)forming a through hole which penetrates the substrate and mutually opposite parts of the first and second tracks; and c) forming, through the through hole, a conductive connection part between the first track formed with the through hole penetrating through and a second hole formed with the through hole penetrating through.
申请公布号 JP2014240527(A) 申请公布日期 2014.12.25
申请号 JP20140191617 申请日期 2014.09.19
申请人 MECO EQUIPMENT ENGINEERS BV 发明人 AUGUSTINUS CORNELIS MARIA VAN DE VEN;RIK FRANCISCUS JOZEF PETER ROZEBOOM
分类号 C25D7/00 主分类号 C25D7/00
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