| 发明名称 |
SUBSTRATE PROCESSING APPARATUS |
| 摘要 |
A substrate processing apparatus configured to rotate a substrate, such as a wafer, is disclosed. The substrate processing apparatus includes: a substrate holder configured to hold and rotate a substrate; a natural frequency calculator configured to determine a natural frequency of the substrate; and a processing controller configured to control a rotational speed of the substrate based on the natural frequency of the substrate. The processing controller is configured to control the rotational speed of the substrate such that the substrate is rotated at a rotational speed that is different from a rotational speed corresponding to the natural frequency of the substrate. |
| 申请公布号 |
US2014373884(A1) |
申请公布日期 |
2014.12.25 |
| 申请号 |
US201414305309 |
申请日期 |
2014.06.16 |
| 申请人 |
EBARA CORPORATION |
发明人 |
Shinozaki Hiroyuki |
| 分类号 |
H01L21/687;B23Q1/64;H01L21/67 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate processing apparatus, comprising:
a substrate holder configured to hold and rotate a substrate; a natural frequency calculator configured to determine a natural frequency of the substrate; and a processing controller configured to control a rotational speed of the substrate based on the natural frequency of the substrate. |
| 地址 |
Tokyo JP |
