METHOD OF DESIGNING POWER SUPPLY NETWORK

摘要

To design a power supply network of a 3D semiconductor device employing through-silicon-via (TSV) technology, board wiring of each of boards of the device is determined. An initial network structure is created for the boards. A layout of power bumps and through-silicon-vias, using the initial network structure, is produced such that voltages of all nodes of wiring of the boards are greater than a reference voltage. A semiconductor device having boards, power bumps and through-silicon-vias conforming to the layout is fabricated. Thus, the numbers of the through-silicon-vias and the power bumps of the power supply network of the semiconductor device are minimal

主权项

1. A method of manufacturing a semiconductor device having a plurality of boards stack one atop the other, wherein each board includes a substrate and wiring integrated with the substrate, and the wiring of each board has a plurality of nodes, the method comprising:
determining board wiring for each of the boards; devising an initial network structure of the boards having the determined board wiring; using the initial network structure to compose a layout of a power supply network having power bumps disposed at respective nodes of the wiring of one of the boards, and through-silicon-vias connecting respective nodes of the wiring of the boards and satisfying a condition in which all of the nodes of the boards have voltages higher than a reference voltage when a voltage is impressed across the boards; and fabricating a semiconductor device of the board having the determined board wiring and power bumps and through-silicon vias conforming to said layout.