发明名称 |
HEAT DISSIPATING SYSTEM |
摘要 |
Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar. |
申请公布号 |
US2014376178(A1) |
申请公布日期 |
2014.12.25 |
申请号 |
US201214376124 |
申请日期 |
2012.02.09 |
申请人 |
Hewlett-Packard Development Company, L.P. |
发明人 |
Moore David A;Franz John P.;Cader Tahir;Sabotta Michael L. |
分类号 |
H05K7/20;H02G5/10 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
1. A heat dissipating system comprising:
a fluid cooled thermal bus bar; a thermal transport to remove heat from a heat-generating component and move the heat to a heat exchanger; a connector to apply a pressure between the thermal bus bar and the heat exchanger to form a thermally conductive dry disconnect interface therebetween. |
地址 |
Fort Collins CO US |