发明名称 HEAT DISSIPATING SYSTEM
摘要 Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
申请公布号 US2014376178(A1) 申请公布日期 2014.12.25
申请号 US201214376124 申请日期 2012.02.09
申请人 Hewlett-Packard Development Company, L.P. 发明人 Moore David A;Franz John P.;Cader Tahir;Sabotta Michael L.
分类号 H05K7/20;H02G5/10 主分类号 H05K7/20
代理机构 代理人
主权项 1. A heat dissipating system comprising: a fluid cooled thermal bus bar; a thermal transport to remove heat from a heat-generating component and move the heat to a heat exchanger; a connector to apply a pressure between the thermal bus bar and the heat exchanger to form a thermally conductive dry disconnect interface therebetween.
地址 Fort Collins CO US