Semiconductor device with anchor means for the sealing resin

摘要

A semiconductor device has a base material (BS) comprised of insulating material having a through hole (SH), a terminal (TE) formed on a lower surface of the base material (BS), and a semiconductor chip mounted on an upper surface of the base material in a face-up manner. Further, the semiconductor device has a conductive member (BW) such as a wire, which electrically connects a pad of the semiconductor chip with an exposed surface of the terminal which is exposed from the through hole (SH) of the base material (BS), and has a sealing body (MR) for sealing the conductive member (BW), inside of the through hole (SH) of the base material (BS), and the semiconductor chip. An anchor (SB) means is provided in a region of the exposed surface (EX(TEa)) of the terminal (TE) which is exposed from the through hole (SH) of the base material (BS) except for a joint portion (BL) joined with the conductive member (BW) such as the wire. In this way the adhesiveness between the exposed surface (EX(TEa) of the terminal (TE) is increased so that the reliability of the semiconductor device may be improved.