摘要 |
<p>An embodiment relates to a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system. A light emitting device according to one embodiment may include a support plate (70); a light emitting structure (10) on the support plate (70); a fluorescent material layer (95) which surrounds the upper surface and the lateral surface of the light emitting structure (10), wherein the lateral surface and the upper surface each have a uniform thickness; and a transparent cap layer (92) on the fluorescent material layer (95).</p> |