发明名称 THERMALLY CONDUCTIVE SHEET AND PROCESS FOR MANUFACTURING THERMALLY CONDUCTIVE SHEET
摘要 Provided are: a thermally conductive sheet which exhibits good thickness-wise thermal conductivity; and a process for manufacturing a thermally conductive sheet. The process includes: preparing a thermally conductive composition which comprises a curable resin composition, a thermally conductive fiber, and thermally conductive particles; extrusion-molding the thermally conductive composition to form a column-shaped cured product; cutting the column-shaped cured product along a direction nearly perpendicular to the length direction of the column into slices having a prescribed thickness; and thus forming a thermally conductive sheet such that the surface of the sheet exhibits an L* value of 29 to 47 in the L*a*b color space.
申请公布号 WO2014203875(A1) 申请公布日期 2014.12.24
申请号 WO2014JP65977 申请日期 2014.06.17
申请人 DEXERIALS CORPORATION 发明人 ARAMAKI, KEISUKE
分类号 H01L23/36;C08J5/18;C08K3/22;C08K3/28;C08K7/06;C08L101/00 主分类号 H01L23/36
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