发明名称 |
Resin dispensing apparatus for light emitting device package and method of manufacturing light emitting device package using the same |
摘要 |
<p>There is provided a resin dispensing apparatus for a light emitting device package and a method of manufacturing a light emitting device package using the same. The resin dispensing apparatus includes a resin dispensing part including a resin storage portion filled with a resin therein and a resin discharge portion combined with the resin storage portion and discharging the resin therefrom; a supporting part having a light emitting device package disposed on an upper surface thereof and electrically connected to the light emitting device package; a voltage applying part having both terminals respectively connected to the resin dispensing part and the supporting part to apply a voltage thereto; and a sensing part electrically connected to the resin dispensing part and the supporting part individually and sensing a contact between the resin dispensing part and the light emitting device package with an electrical signal.
</p> |
申请公布号 |
EP2455204(A3) |
申请公布日期 |
2014.12.24 |
申请号 |
EP20110190027 |
申请日期 |
2011.11.22 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM, JOO YONG;CHOI, SEUNG KI;HONG, JEE HUN |
分类号 |
B29C39/10;B29C31/04;B29C39/24;B29C39/44;B29L11/00 |
主分类号 |
B29C39/10 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|