| 摘要 |
A flat cable wafer for interconnection between a first plurality of conductors imbedded in the wafer in a first plane and a second pair of conductors imbedded in the wafer in a second plane. Each of the first plurality of conductors is positioned so as to be interconnectible with each of the second plurality of conductors, the wafer being formed of an insulating material which, upon application of heat transverse to the plane of the wafer causes at least one of said conductors in each of the plurality of planes to be joined together.
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