发明名称 発光装置およびその製造方法
摘要 A semiconductor light-emitting device and a method for manufacturing the same can include a wavelength converting layer located over at least one semiconductor light-emitting chip in order to emit various colored lights including white light. The light-emitting device can include a base board, a frame located on the base board, the chip mounted on the base board, the wavelength converting layer located between an optical plate and the chip so as to extend from the optical plate toward the chip, and a reflective material layer disposed at least between the frame and both side surfaces of the wavelength converting layer and the optical plate.
申请公布号 JP5647028(B2) 申请公布日期 2014.12.24
申请号 JP20110028841 申请日期 2011.02.14
申请人 发明人
分类号 H01L33/50;H01L33/58 主分类号 H01L33/50
代理机构 代理人
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