发明名称 |
3D RF L-C FILTERS USING THROUGH GLASS VIAS |
摘要 |
<p>Three-dimensional (3D) Radio Frequency (RF) inductor-capacitor (LC) band pass filters having through-glass-vias (TGVs). One such L-C filter circuit includes a glass substrate, a first portion of a first inductor formed on a first surface of the glass substrate, a second portion of the first inductor formed on a second surface of the glass substrate, and a first set of TGVs configured to connect the first and second portions of the first inductor. Additionally the L-C filter circuit can include a second inductor similar to the first inductor, and a metal-insulator-metal (MIM) capacitor formed between the first and second inductor, such that the first and second inductor are coupled through the MIM capacitor.</p> |
申请公布号 |
EP2815504(A1) |
申请公布日期 |
2014.12.24 |
申请号 |
EP20130709600 |
申请日期 |
2013.02.11 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
YUN, CHANGHAN;ZUO, CHENGJIE;LO, CHI SHUN;KIM, JONGHAE;VELEZ, MARIO F. |
分类号 |
H03H7/01;H03H7/09 |
主分类号 |
H03H7/01 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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