| 摘要 |
A heat dissipation structure includes a substrate 32, a surface mounted LED 34 and at least one engaging member 36 made of thermally conductive metal. Conductive copper foils 44 cover faces 38, 40 of the substrate. Two electrodes 46 are provided on a surface of the LED 34 and are connected to copper foil 44 on face 38. A hole 48 extends through the copper foils 44 and through the substrate 32. The engaging member 36 is placed in the hole 48 to join the copper foils 44 and the substrate 32. Heat generated by the LED 34 is directly transferred to the copper foils via the engaging member 36 for better heat dissipation and performance of the LED 34. |
