| 摘要 |
<p>The invention relates to a method for the inspection of flat objects, in particular wafers (10, 12, 14, 16, 18, 20, 24, 26, 28, 30), comprising the following steps: recording one digital image of the object surface of several homogeneous objects of a series in each case, wherein each digital image consists of a multiplicity of pixels having an intensity value assigned to the said pixel; and detecting defects on the respective object surface by comparing the recorded image with a reference image; wherein the images of the objects of the whole series are recorded before the comparison with the reference image, and the reference image is generated from several or all images of the series, e.g. by averaging (median) the images of the series.</p> |
