COMPOSITION FOR ENCAPSULATION MATERIAL FILM, ENCAPSULATION MATERIAL FILM, AND ELECTRONIC DEVICE COMPRISING SAME

摘要

The present application relates to a composition for an encapsulation material film, an encapsulation material film, and an electronic device comprising the same. In the present application, it is possible to provide an encapsulation material film having excellent moisture barrier properties, handling properties, workability, and durability, and a structure including an element which is encapsulated by means of the encapsulation material film.