Semiconductor device and method for fabricating a semiconductor device

摘要

A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials are arranged adjacent one another in a common plane.

主权项

1. A semiconductor device, comprising:
a body comprising: a first portion comprising a first semiconductor material having a first bandgap; a second portion comprising a second semiconductor material having a second bandgap, the second bandgap being different from the first bandap; and the first portion and the second portion being coplanar and dielectrically insulated from one another; and wherein the body is disposed on a substrate with the first and second portions being laterally adjacent to one another on the substrate, wherein the substrate includes a first region and a second region laterally adjacent to one another, the first region below the first portion and comprising a first substrate material, and the second region below the second portion and comprising a second substrate material which is different from the first substrate material.