发明名称 Circuit board fixing device
摘要 An electronic device includes a circuit substrate, a bottom case, and a top case. The circuit substrate has a plurality of slits penetrating therethrough. The bottom case has a groove portion positioned at an inside surface of the bottom case such that edge portions of the circuit substrate are slidable and inserted into the groove portion. Besides, a plurality of pin-shaped protrusion portions is provided in the bottom case to be snib-fitted with the top case, and each protrusion portion has a plurality of locking portions at a tip end portion. Each protrusion portion elastically biases the circuit substrate toward the top side of the bottom case and presses the circuit substrate to a top surface of the groove portion by locking the locking portions to the circuit substrate after the locking portions are respectively inserted into the slits.
申请公布号 US8917519(B2) 申请公布日期 2014.12.23
申请号 US201213724001 申请日期 2012.12.21
申请人 Denso Corporation 发明人 Sano Yoshimasa
分类号 H05K5/00;H05K5/02;H05K7/14 主分类号 H05K5/00
代理机构 Harness, Dickey & Pierce, PLC 代理人 Harness, Dickey & Pierce, PLC
主权项 1. An electronic device comprising: a circuit substrate provided with an electronic circuit; a bottom case that is made of resin, has an opening portion at a top side, and receives and holds the circuit substrate; and a top case that has an opening portion at a bottom side, and is attached to the bottom case from the top side of the bottom case, wherein the circuit substrate has a plurality of slits penetrating through the circuit substrate, the bottom case has a groove portion positioned at an inside surface of the bottom case such that edge portions of the circuit substrate are slidable and inserted into the groove portion, and the bottom case is provided with a plurality of pin-shaped protrusion portions, each protrusion portion has a plurality of locking portions at a tip end portion, and each protrusion portion has a snib-shape and elastically biases the circuit substrate toward the top side of the bottom case and presses the circuit substrate to a top surface of the groove portion by locking the locking portions to the circuit substrate after the locking portions are respectively inserted into the slits from a top side of the circuit substrate.
地址 Kariya JP