发明名称 |
Circuit board assembly and camera module using same |
摘要 |
A circuit board assembly includes a flexible circuit board, a conductive adhesive, and a number of reinforcing plates. The flexible circuit board includes a first surface and a second surface. A number of board pads are mounted on the first surface. The conductive adhesive is coated on the first surface and entirely covers all of the board pads. The reinforcing plates are positioned on the second surface. Each of the reinforcing plates spatially corresponds to a respective one of the board pads. The reinforcing plates provide both physical grounding and stiffening of the circuit board assembly. |
申请公布号 |
US8917340(B2) |
申请公布日期 |
2014.12.23 |
申请号 |
US201213727467 |
申请日期 |
2012.12.26 |
申请人 |
Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.;Hon Hai Precision Industry Co., Ltd. |
发明人 |
Cheng Yu-Tsan;Chen Wen-Chang;Chen Shin-Wen;Chen Wen-Hsiung;Peng Shu-Sheng |
分类号 |
H04N5/335;H04N5/225;H01L23/12;H05K1/02;H05K1/14;H05K3/32 |
主分类号 |
H04N5/335 |
代理机构 |
Novak Druce Connolly Bove + Quigg LLP |
代理人 |
Novak Druce Connolly Bove + Quigg LLP |
主权项 |
1. A circuit board assembly, comprising:
a flexible circuit board comprising a first surface and a second surface facing away from the first surface, the flexible circuit board comprising a plurality of board pads mounted on the first surface; a conductive adhesive coated on the first surface and entirely covering all of the board pads; and a plurality of reinforcing plates positioned on the second surface, each of the reinforcing plates being substantially rectangular in shape and spatially aligned with a respective one of the board pads, the reinforcing plates configured for providing physical grounding and stiffening of the circuit board assembly. |
地址 |
Shenzhen CN |