Method and apparatus for cleaning grinding work chuck using a vacuum

摘要

A vacuum assembly for removing debris formed on the surface of a work chuck after a wafer grinding process by positioning a vacuum source above the work chuck and then activating the vacuum source.

主权项

1. A grind apparatus for grinding a surface of a workpiece comprising:
a grind wheel; a porous work chuck having top and bottom surfaces; means for rotating said work chuck and said grind wheel; a first vacuum source positioned adjacent the bottom surface of said work chuck for holding said workpiece in position on said bottom surface of said work chuck; a vacuum assembly positioned adjacent to said bottom surface of said work chuck; means for introducing a fluid flow to the grind apparatus whereby said vacuum assembly is caused to hover above said top surface of said work chuck; means for moving said vacuum assembly across the top surface of said work chuck; and means for energizing said vacuum assembly whereby particles on the top surface of said work chuck remaining after grinding of said workpiece are substantially removed.