Pad and circuit layout for semiconductor devices

摘要

An apparatus includes an image sensor with a frontside and a backside. The image sensor includes an active circuit region and bonding pads. The active circuit region has a first shape that is substantially rectangular. The substantially rectangular first shape has first chamfered corners. A perimeter of the frontside of the image sensor has a second shape that is substantially rectangular. The second substantially rectangular shape has second chamfered corners. The bonding pads are disposed on the frontside of the image sensor. The bonding pads are disposed between the first chamfered corners and the second chamfered corners. The first shape is disposed inside the second shape.

主权项

1. An apparatus comprising:
an image sensor with a frontside and a backside, the image sensor comprising:
an active circuit region having a first shape that is substantially rectangular, wherein the first shape has first chamfered corners, and wherein a perimeter of the frontside of the image sensor has a second shape that is substantially rectangular, the second shape having second chamfered corners; andbonding pads disposed on the frontside of the image sensor, wherein the bonding pads are disposed between the first chamfered corners and the second chamfered corners, and wherein the first shape is disposed inside the second shape, and wherein a first chamfer length of each of the first chamfered corners is longer than a second chamfer length of each of the second chamfered corners.