| 摘要 |
The present invention relates to a fingerprint recognition module which employs a simple packaging process and an affordable structure. The fingerprint recognition module has high signal reception rate between a transciever unit and a target fingerprint and is manufactured through a simple process. The fingerprint recognition module according to the present invention includes: a support; an integrated circuit unit which is arranged on the upper surface of the support to generate signals to be transmitted and process received signals; a film unit which is coupled to the upper surface of the integrated circuit unit and includes a transmission end, reception end, and an I/O terminal; and a molding unit which seals at least a part of the integrated circuit unit and the film unit. |
