CHIP ON BOARD LIGHT EMITTING DIODE DEVICE HAVING DISSIPATION UNIT ARRAY

摘要

A chip on board light emitting diode (LED) device comprises a LED device, a printed circuit board (PCB) and a dissipation unit array. The LED device comprises a LED substrate, a first contact pad and a second contact pad above the LED substrate and a thermal layer formed on top surface of the LED device. The thermal layer comprises a thermal conductive material. A printed circuit board (PCB) comprises a PCB substrate with a thermal projection extending from surface of the PCB substrate, and a first and a second electrode pads above the PCB substrate. The thermal projection and the PCB substrate comprise the thermal conductive material. The dissipation unit array comprises a plurality of dissipation units each disposed between the LED device and the PCB. The thermal layer is thermally coupled to the thermal projection via at least one dissipation unit. Each of the first and second contact pads is electrically coupled to the corresponding electrode pad via at least one dissipation unit.

主权项

1. A chip on board light emitting diode device comprising:
a light emitting diode device comprising:
a light emitting diode substrate;a light emitting diode conductive layer forming a first contact pad and a second contact pad above the light emitting diode substrate; anda thermal layer formed on top surface of the light emitting diode substrate, the thermal layer comprising a first thermal conductive material; a printed circuit board comprising:
a printed circuit board substrate with a thermal projection projecting from surface of the printed circuit board substrate, the thermal projection and the printed circuit board substrate comprising a second thermal conductive material;a printed circuit board conductive layer forming a first electrode pad and a second electrode pad above the printed circuit board substrate; and a dissipation unit array comprising a plurality of dissipation units each disposed between the light emitting diode device and the printed circuit board; and wherein the thermal layer is thermally coupled to the thermal projection via at least one of the plurality of dissipation units; and wherein the first contact pad is electrically coupled to the first electrode pad via one of the plurality of dissipation units, and the second contact pad is electrically coupled to the second electrode pad.