| 摘要 |
A method for depositing a metal containing material onto a porous substrate, the method comprises forming a seed coating on the substrate, wherein the seed coating at least partially covers the substrate, the seed coating being substantially free of precious metal and applying a metal containing material to the seed coating, wherein the surface area of the substrate is greater than 0.02 m2/cc, as determined prior to coating the substrate. Non-porous substrates may also be coated using a similar process. |
