发明名称 |
WHITE CURABLE COMPOSITION FOR OPTICAL SEMICONDUCTOR DEVICE, WHITE TABLET FOR OPTICAL SEMICONDUCTOR DEVICE, MOLDING FOR OPTICAL SEMICONDUCTOR DEVICE, AND OPTICAL SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a white curable composition for optical semiconductor devices, from which a tablet hardly causing chips and excellent in homogeneity can be obtained and a molding with less defects in appearance can be obtained.SOLUTION: The white curable composition for optical semiconductor devices includes an epoxy compound, an acid anhydride curing agent, a white pigment, a filler other than the white pigment, and a cure accelerator. The white curable composition for optical semiconductor devices is subjected to a compression pressure of 3 t to be formed into a columnar tablet with a diameter of 13 mm and a height of 30 mm. The columnar tablet has a compression modulus of 100 MPa or more and 2000 MPa or less, and a compression strength of 300 N or more. |
申请公布号 |
JP2014237841(A) |
申请公布日期 |
2014.12.18 |
申请号 |
JP20140161613 |
申请日期 |
2014.08.07 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
SHIKAGE TAKASHI;HIGUCHI ISAO;FUKUDA TAKASHI;KOBAYASHI YOSHIKI;YASUI HIDEFUMI |
分类号 |
C08L63/00;C08G59/42;C08K3/00;C08K3/22;C08K3/34;H01L33/60 |
主分类号 |
C08L63/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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