| 摘要 |
PROBLEM TO BE SOLVED: To provide a capacitance substrate capable of improving mounting reliability in connecting the capacitance substrate and a package. ! SOLUTION: The capacitance substrate includes: an insulation substrate 1; a first electrode layer 2 provided on an upper surface of the insulation substrate 1; a second electrode layer 3 provided so as to face the first electrode layer 2 under surface of the insulation substrate 1; and an electrode 4 for connection provided on an under surface of the second electrode layer 3. In a plan view, a plurality of electrodes 4 for connection are provided in island-like shapes. ! COPYRIGHT: (C)2015,JPO&INPIT |
