发明名称 INFORMATION PROCESSING APPARATUS, METHOD FOR CONTROLLING THE SAME AND PROGRAM
摘要 An information processing apparatus according to an aspect of the present invention generates temperature distribution information (updated temperature information) that indicates the current temperature distribution in a memory chip, based on predetermined temperature information generated by an analysis executed in advance and temperature information obtained by a temperature sensor. The predetermined temperature information includes information related to the temperature distribution in the memory chip that corresponds to the operating states of an SoC die and a wide IO memory device. The information processing apparatus sets a thermal offset value to be used in the refresh operation of the memory chip, according to the difference between the temperature at the location of the temperature sensor and the temperature at a hotspot in the memory chip, which are included in the temperature distribution indicated by the updated temperature information.
申请公布号 US2014371945(A1) 申请公布日期 2014.12.18
申请号 US201314374506 申请日期 2013.10.30
申请人 CANON KABUSHIKI KAISHA 发明人 Sato Yoshikazu
分类号 G05D23/19;G05B15/02 主分类号 G05D23/19
代理机构 代理人
主权项 1. An information processing apparatus comprising: a wide IO memory device stacked on an SoC die that includes a CPU; an acquisition unit configured to acquire, from a temperature sensor provided in a memory chip that is included in the wide IO memory device, sensor information that indicates a temperature of the memory chip at the location of the temperature sensor; a generation unit configured to generate temperature distribution information that indicates a current temperature distribution in the memory chip, based on the sensor information acquired by the acquisition unit and predetermined temperature information that includes information that was generated using an analysis executed in advance and is related to the temperature distribution in the memory chip, the predetermined temperature information corresponding to operating states of the SoC die and the wide IO memory device; and a setting unit configured to set a thermal offset value to be used for a refresh operation of the memory chip in accordance with a difference between the temperature at a location at which the temperature is the highest in the memory chip and the temperature at the location of the temperature sensor that are included in the temperature distribution indicated by the temperature distribution information.
地址 Tokyo JP
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