发明名称 METHOD OF FABRICATING HIGH VOLTAGE DEVICE
摘要 A method of fabricating a high voltage device includes the step of forming a patterned photoresist layer on a conductive layer and a dielectric below the conductive. The conductive layer and the dielectric layer are patterned by taking the patterned photoresist layer as a mask. Subsequently the patterned photoresist layer is shrunk. The conductive layer and the dielectric layer are then patterned by taking the shrunk photoresist layer as a mask.
申请公布号 US2014370680(A1) 申请公布日期 2014.12.18
申请号 US201313918993 申请日期 2013.06.17
申请人 UNITED MICROELECTRONICS CORP. 发明人 Chen Yi-Hao;Lee Wen-Yu;Liu Hsiao-Wen;Chen Jung-Ching
分类号 H01L21/308;H01L29/66 主分类号 H01L21/308
代理机构 代理人
主权项 1. A method of fabricating a high voltage device, comprising: providing a substrate having a dielectric layer, a conductive layer and a photoresist layer disposed on the substrate from bottom to top; patterning the photoresist layer to form a patterned photoresist layer having a first width; performing a first patterning step to pattern the conductive layer and the dielectric layer by taking the patterned photoresist layer as a first mask; shrinking the first width of the patterned photoresist layer to a second width; performing a second patterning step to pattern the conductive layer and the dielectric layer by taking the shrunk photoresist layer as a second mask so as to form the dielectric layer into a step profile; and removing the shrunk photoresist layer.
地址 Hsin-Chu City TW
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