发明名称 |
LED MODULE |
摘要 |
The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation. The LED module includes: a circuit board; a plurality of LED dies that are mounted on one surface of a circuit board as bare chips and constitute a series circuit; an FET die that is mounted on the one surface of a circuit board as bare chips and controls a current flowing through the plurality of LED dies; and a constant current circuit that is mounted on the one surface of a circuit board and is series-connected to the series circuit. The constant current circuit includes the FET die. |
申请公布号 |
US2014367710(A1) |
申请公布日期 |
2014.12.18 |
申请号 |
US201214367010 |
申请日期 |
2012.12.20 |
申请人 |
Akiyama Takashi;Watanabe Shigehisa;Arai Hidekazu;Ochiai Yuki |
发明人 |
Akiyama Takashi;Watanabe Shigehisa;Arai Hidekazu;Ochiai Yuki |
分类号 |
H01L33/62;H01L33/50;H05B33/08 |
主分类号 |
H01L33/62 |
代理机构 |
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代理人 |
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主权项 |
1. An LED module comprising:
a circuit substrate; a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit; an FET die, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies; and a constant current circuit mounted on said one surface of said circuit substrate and connected in series with said series circuit, wherein said constant current circuit includes said FET die. |
地址 |
Saitama JP |