发明名称 LED MODULE
摘要 The purpose of the present invention is to reduce the size and thickness of an LED module in which a plurality of LED dies along with other electronic components are mounted on a circuit board, and at the same time to stabilize the operation of the module with respect to source voltage fluctuation. The LED module includes: a circuit board; a plurality of LED dies that are mounted on one surface of a circuit board as bare chips and constitute a series circuit; an FET die that is mounted on the one surface of a circuit board as bare chips and controls a current flowing through the plurality of LED dies; and a constant current circuit that is mounted on the one surface of a circuit board and is series-connected to the series circuit. The constant current circuit includes the FET die.
申请公布号 US2014367710(A1) 申请公布日期 2014.12.18
申请号 US201214367010 申请日期 2012.12.20
申请人 Akiyama Takashi;Watanabe Shigehisa;Arai Hidekazu;Ochiai Yuki 发明人 Akiyama Takashi;Watanabe Shigehisa;Arai Hidekazu;Ochiai Yuki
分类号 H01L33/62;H01L33/50;H05B33/08 主分类号 H01L33/62
代理机构 代理人
主权项 1. An LED module comprising: a circuit substrate; a plurality of LED dies mounted directly in bare chip form on one surface of said circuit substrate and arranged so as to form a series circuit; an FET die, mounted directly in bare chip form on said one surface of said circuit substrate, for limiting current flowing through said plurality of LED dies; and a constant current circuit mounted on said one surface of said circuit substrate and connected in series with said series circuit, wherein said constant current circuit includes said FET die.
地址 Saitama JP