Heat dissipating system and method are disclosed. An example method includes removing heat from a rack component via a thermal transport. The method also includes applying a pressure at a fluid cooled thermal bus bar on a rack system to form a thermally conductive dry disconnect interface and form a heat path between the thermal transport and the fluid cooled thermal bus bar.
申请公布号
EP2812769(A1)
申请公布日期
2014.12.17
申请号
EP20120867753
申请日期
2012.02.09
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
发明人
MOORE, DAVID;FRANZ, JOHN P.;CADER, TAHIR;SABOTTA, MICHAEL L.