MULTILAYER ELECTRONICS ASSEMBLY AND METHOD FOR EMBEDDING ELECTRICAL CIRCUIT COMPONENTS WITHIN A THREE DIMENSIONAL MODULE

摘要

A multilayer electronics assembly and associated method of manufacture are provided. The multilayer electronics assembly includes a plurality of stacked substrate layers. Each of the substrate layers is fusion bonded to at least an adjacent one of the plurality of substrate layers. A first discrete electrical circuit component is bonded to a first layer of the plurality of layers. A bonding material is interposed between the discrete electrical circuit component and the first layer. The bonding material has a reflow temperature at which the bonding material becomes flowable that is higher than a fusion bonding temperature of the substrate layers.