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发明名称
Coil arrangement with metal filling
摘要
<p>Devices, methods and production devices that relate to the forming of a coil on a semiconductor substrate are provided. Arranged within the coil is a metal filling, for example with a density of less than 20%.</p>
申请公布号
GB201419640(D0)
申请公布日期
2014.12.17
申请号
GB20140019640
申请日期
2014.11.04
申请人
LANTIQ DEUTSCHLAND GMBH
发明人
分类号
主分类号
代理机构
代理人
主权项
地址
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