发明名称 基板処理装置
摘要 <p>A substrate treatment apparatus includes: a treatment chamber in which a substrate is treated; a substrate holding unit which holds the substrate in the treatment chamber; a shield member disposed above the substrate holding unit and having an opposing surface to be brought into opposed relation to the substrate holding unit; and a gas supply portion which has a downward gas supply port having an annular shape to surround the shield member as seen in plan and is disposed on an upper portion of the treatment chamber for supplying a gas into the treatment chamber.</p>
申请公布号 JP5641556(B2) 申请公布日期 2014.12.17
申请号 JP20090226263 申请日期 2009.09.30
申请人 发明人
分类号 H01L21/304;H01L21/027 主分类号 H01L21/304
代理机构 代理人
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