摘要 |
<p>A substrate treatment apparatus includes: a treatment chamber in which a substrate is treated; a substrate holding unit which holds the substrate in the treatment chamber; a shield member disposed above the substrate holding unit and having an opposing surface to be brought into opposed relation to the substrate holding unit; and a gas supply portion which has a downward gas supply port having an annular shape to surround the shield member as seen in plan and is disposed on an upper portion of the treatment chamber for supplying a gas into the treatment chamber.</p> |