| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a die device for manufacturing a microcomponent with an improved yield by preventing drag in gate-cut after resin cure even if a lateral runner has linear structure. <P>SOLUTION: The die device for manufacturing a microcomponent includes: a fixed die having a sprue bush 2 with a sprue formed thereon, and a cavity plate 3 having a horizontal runner B and a vertical runner R2 formed thereon; and a movable die disposed to face the cavity plate and to be opened and closed. The sprue bush is movable in a longitudinal direction with respect to the cavity plate, and a stripper plate is disposed to be movable in a longitudinal direction of the sprue bush with respect to the sprue bush. A presser member has: a presser bar functioning to press the horizontal runner after resin filled in the cavity is molded; and a block body 4b supporting the pressor bar. The pressor member is detachably stuck to the stripper plate, and the presser member is fit in the cavity. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
