| 摘要 |
PROBLEM TO BE SOLVED: To provide a Pb-free Au-Ge-Sn-based solder alloy for high temperature which is excellent in various properties such as processability, wettability, a stress relaxation property and the like, which can be sufficiently used at a joint requiring very high reliability in a crystal device, a SAW filter and the like and which is inexpensive.SOLUTION: In an Au-Ge-Sn-based solder alloy, the content of Ge is 0.01 mass% or more and 10.0 mass% or less, the content of Sn is 32.0 mass% or more and 40.0 mass% or less and the balance is Au and inevitable impurities. Further, the solder alloy can contain P by 0.500 mass% or less. |
